Scope of application and advantages of the plugging system
Vacuum chamber plugging systems from MASS are used to fill holes in printed circuit boards with conductive or non-conductive paste. Through holes and blind holes can be filled on both sides in one cycle. The machine can be viewed for inspection purposes and is therefore equipped with Makrolon sheets on both sides. The operator can program multiple plugging passes if desired, this is the great advantage of plugging under vacuum in an evacuated vacuum chamber. Also, if there are still any defects, the same PCB can be plugged again.
Function and structure of the plugging system
The plugging machine has a modular design. Depending on the required capacity, the system solution can be subsequently expanded by the VCP 2 at any time. All connections for this are available. The capacity depends on the aspect ratio of the hole to be filled, the board thickness and the viscosity of the paste.
After the PCB has been picked up in vertical position at the top by the clamping system, the door is closed and the vacuum process in the process chamber starts. After approx. 15 seconds, the vacuum is reached. The filling process starts by pushing the paste out of a cartridge into the holes by means of pistons while the filling heads are moved over the PCB. The contact pressure of the filling heads against the PCB and the paste pressures for the front and rear filling heads can be set separately. The vertical movement is performed by an adjustable servo motor. The paste is stored in refillable cartridges. The front door is monitored by a safety light grid. The machine is operated via a touch PC, which manages the visualization and the various formulas.
Data Recording System for order entry and LCS System for automatic cartridge refilling are optional. Different heatable heads and face plates are available depending on the PCB format.
In the second station outside the vacuum area, the PCB surface can be squeegeed again, if necessary, using double-sided screen printing squeegees. This reduces the excess paste layer thickness on the copper surfaces from approx. 20 to approx. 6 µm. The front access to the squegee device (ES) is monitored by a safety light grid.
- Dimensions: Length 2,500 mm, width 630 mm and height 2,100 mm
- Weight: 950 kg
- Clearance: 800 mm (1000 mm back side)
- Panel dimensions: 610 x 760 mm
- Panel thickness: 0.25 - 7.5 mm
- Connection: 3 x 400 V, PE, 50 Hz, 5 kW
- Control: Siemens PLC S7 300, PC VISU
- Compressed air: 6 bar (88 psi) 30 NL per panel
- Room temperature: 22 +/- 2°C
- Rel. Humidity: 50 +/- 10 %