• SV 100 type grinding machine

    Removing excess plugging paste 

    The SV 100 grinding machine removes excess plugging paste from printed circuit boards and inner layers after the via hole filling process. This creates a flat, uniform surface.

     

    How it works

    The inner layer or printed circuit board is held onto the multiplex wood work surface using a vacuum. Even slightly bowed inner layers are vacuumed on flat so they cannot slide during the later grinding process. The linear guides and adjustable grinding pressure create outstanding grinding results. This minimizes the risk of potentially grinding through the copper foil. The grinder head can be lowered toward the circuit board with a setting precision of 0.22 µm. The grinder head is moved manually across the printed circuit board.

     

     

     

     

  • Application areas for the SV 100 grinding machine

    • Deburring and grinding bore holes (stiff printed circuit boards)
    • Grinding after galvanizing
    • Grinding after pattern plating
    • Cleaning and grinding pressure plates

    Technical data

    • Maximum circuit board size: 760 x 760 mm
    • Circuit board thickness: 0.3 – 15 mm
    • Setting precision: 0.22 µm
    • Electrical connection: 400V/480V, 50 - 60 Hz, 5kW
  • SV 200 WV type grinding machine (wet)

    Removing excess plugging paste 

    The SV 200 WV grinding machine removes excess plugging paste from printed circuit boards and inner layers after the via hole filling process. This creates a flat, uniform surface.

     

    How it works

    The inner layer or printed circuit board is held onto the aluminium work plate using a vacuum. Even slightly bowed inner layers are vacuumed on flat so they cannot slide during the later grinding process. The linear guides and adjustable grinding pressure create outstanding grinding results. This minimizes the risk of potentially grinding through the copper foil. The grinder head can be lowered toward the circuit board with a setting precision of 0.22 µm. The grinder head is moved manually across the printed circuit board.

    Cooling water is transported to the grinding head via a pump. The coolant passes through a belt filter that is installed in the machine frame underneath.

     

     

     

     

  • Application areas for the SV 200 grinding machine

    • Deburring and grinding bore holes (stiff printed circuit boards)
    • Grinding after galvanizing
    • Grinding after pattern plating
    • Cleaning and grinding pressure plates

    Technical data

    • Maximum circuit board size: 915 x 610 mm
    • Circuit board thickness: 0.3 – 15 mm
    • Setting precision: 0.22 µm
    • Electrical connection: 400V/480V, 50 - 60 Hz, 5kW